HS 8542: Electronic integrated circuits.

Erläuternde Anmerkungen

Electronic integrated circuits This heading includes interchangeable pre-programmed memory modules in the form of a monolithic integrated circuit for electronic translation devices falling in subheadings 8470 10 00 and 8543 70 10 . This heading does not include discs (sometimes referred to as wafers) which, for the purposes of their applications in the field of electronics, consist of doped...

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits These subheadings include: 1. microprocessors, also called micro processing units (MPUs), which are integrated circuits that can be defined as devices that perform the primary instruction, execution and system control functions. They consist...

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Goods specified in note 9(b)(3 and 4) to this chapter See the HS Explanatory Note to heading 8542 , (III).

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Static random-access memories (S-RAMs), including cache random-access memories (cache-RAMs) Cache random-access memories (cache-RAMs) are static random-access memories with an access time faster than the main memory. Cache-RAMs are generally used as temporary buffer memories to accommodate the speed differential between a central processing unit and the main memory.

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Electrically erasable, programmable, read only memories (E2PROMs), including flash E2PROMs E2PROMs are in general byte-erasable memories. Flash E2PROMs are memories also called ‘flash Memories’, ‘flash EPROMs’ or ‘flash EEPROMs’. Flash memories may be based on EPROM or E2PROM-technology and are electrically erasable, either totally (bulk-wise) or by sector (page- or block-wise). Programming,...

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Other memories This subheading includes content addressable memories (CAMs) and ferroelectric memories. Content addressable memories (CAMs) are content associative storage devices. Storage locations of these devices are identified by their contents or by part of their contents, rather than by their names or positions (addresses). Ferroelectric memories are non-volatile memories obtained by...

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Other These subheadings include: 1. full custom logic circuits which are defined by and produced for a single user. The manufacturing process involves routing and placement of cells (logic gates), using fully customised diffusion masks. Full custom logic circuits are designed to perform application-specific functions. They are known as application-specific integrated circuits, so called...

Source: eu_cn_en (EUR-Lex 02019XC0329(02)-20250113)

Chapter 85 Notes (15)

1. 1. This Chapter does not cover: • (a) Electrically warmed blankets, bed pads, foot-muffs or the like; electrically warmed clothing, footwear or ear pads or other electrically warmed articles worn on or about the person; • (b) Articles of glass of heading 70.11; • (c) Machines and apparatus of heading 84.86; • (d) Vacuum apparatus of a kind used in medical, surgical, dental or veterinary sciences (heading 90.18); or • (e) Electrically heated furniture of Chapter 94.

2. 2. Headings 85.01 to 85.04 do not apply to goods described in heading 85.11, 85.12, 85.40, 85.41 or 85.42. However, metal tank mercury arc rectifiers remain classified in heading 85.04.

3. 3. For the purposes of heading 85.07, the expression "electric accumulators" includes those presented with ancillary components which contribute to the accumulator's function of storing and supplying energy or protect it from damage, such as electrical connectors, temperature control devices (for example, thermistors) and circuit protection devices. They may also include a portion of the protective housing of the goods in which they are to be used.

4. 4. Heading 85.09 covers only the following electro-mechanical machines of the kind commonly used for domestic purposes: • (a) Floor polishers, food grinders and mixers, and fruit or vegetable juice extractors, of any weight; • (b) Other machines provided the weight of such machines does not exceed 20 kg. The heading does not, however, apply to fans or ventilating or recycling hoods incorporating a fan, whether or not fitted with filters (heading 84.14), centrifugal clothes-dryers,...

5. 5. For the purposes of heading 85.17, the term “smartphones” means telephones for cellular networks, equipped with a mobile operating system designed to perform the functions of an automatic data processing machine such as downloading and running multiple applications simultaneously, including third-party applications, and whether or not integrating other features such as digital cameras and navigational aid systems.

6. 6. For the purposes of heading 85.23: • (a) “Solid-state non-volatile storage devices” (for example, “flash memory cards” or “flash electronic storage cards”) are storage devices with a connecting socket, comprising in the same housing one or more flash memories (for example, "FLASH E2 PROM") in the form of integrated circuits mounted on a printed circuit board. They may include a controller in the form of an integrated circuit and discrete passive components such as capacitors and...

7. 7. For the purposes of heading 85.24, “flat panel display modules” refer to devices or apparatus for the display of information, equipped at a minimum with a display screen, which are designed to be incorporated into articles of other headings prior to use. Display screens for flat panel display modules include, but are not limited to, those which are flat, curved, flexible, foldable or stretchable in form. Flat panel display modules may incorporate additional elements, including those...

8. 8. For the purpose of heading 85.34 “printed circuits” are circuits obtained by forming on an insulating base, by any printing process (for example, embossing, plating-up, etching) or by the “film circuit” technique, conductor elements, contacts or other printed components (for example, inductances, resistors, capacitors) alone or interconnected according to a pre-established pattern, other than elements which can produce, rectify, modulate or amplify an electrical signal (for example,...

9. 9. For the purpose of heading 85.36, “connectors for optical fibres, optical fibre bundles or cables” means connectors that simply mechanically align optical fibres end to end in a digital line system. They perform no other function, such as the amplification, regeneration or modification of a signal.

10. 10. Heading 85.37 does not include cordless infrared devices for the remote control of television receivers or other electrical equipment (heading 85.43).

11. 11. For the purposes of heading 85.39, the expression “light-emitting diode (LED) light sources” covers: • (a) “Light-emitting diode (LED) modules” which are electrical light sources based on light-emitting diodes (LED) arranged in electrical circuits and containing further elements like electrical, mechanical, thermal or optical elements. They also contain discrete active elements, discrete passive elements, or articles of heading 85.36 or 85.42 for the purposes of providing power supply or...

12. 12. For the purpose of headings 85.41 and 85.42: (a)(i)“Semiconductor devices” are semiconductor devices the operation of which depends on variations in resistivity on the application of an electric field or semiconductor-based transducers. Semiconductor devices may also include assembly of plural elements, whether or not equipped with active and passive device ancillary functions. “Semiconductor-based transducers” are, for the purposes of this definition, semiconductor-based sensors,...

13. 1. “Components” may be discrete, manufactured independently then assembled onto the rest of the MCO, or integrated into other components.

14. 2. “Silicon based” means built on a silicon substrate, or made of silicon materials, or manufactured onto integrated circuit die.

15. 3. (a) “Silicon-based sensors” consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of detecting physical or chemical phenomena and transducing these into electric signals, caused by resulting variations in electric properties or displacement of a mechanical structure. “Physical or chemical phenomena” relates to phenomena, such as pressure, acoustic waves, acceleration, vibration, movement,...

Electronic integrated circuits.

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